Basic Product Information
Part Number: 10M08SAM153I7G
| Field |
Value |
| Manufacturer |
Intel (Altera) |
| Device Type |
10M08SAM153I7G |
| Model Interpretation |
10M = MAX 10 family; 08 = 8K logic elements; SA = Single ADC, S (small form factor) package; M = MBGA-153; 153 = 153-pin; I = Industrial grade (-40°C to 100°C); 7 = Speed grade 7; G = RoHS6 compliant |
| Compliance |
RoHS6 Compliant, REACH Unaffected, ECCN: EAR99 |
| Grade |
Industrial |
Core Electrical Parameters
| Parameter |
Value |
Unit |
| Logic Elements (LEs) |
8,000 |
LEs |
| Logic Array Blocks (LABs) |
500 |
LABs |
| Total RAM Bits (M9K Blocks) |
387,072 |
bits |
| Number of I/O |
112 |
pins |
| Embedded Multipliers |
1 (18×18) / 2 (9×9) |
blocks |
| ADC Resolution |
12-bit SAR |
bits |
| ADC Sampling Rate |
Up to 1 MSPS |
samples/s |
| Analog Inputs (Single ADC) |
Up to 17 single-ended |
pins |
| PLLs |
2 |
PLLs |
| Supply Voltage (VCC) |
2.85 ~ 3.465 |
V |
| Core Voltage (VCCINT) |
1.2 |
V |
| User Flash Memory (UFM) |
Yes (non-volatile) |
— |
| Dual Configuration Flash |
Yes (internal) |
— |
| On-chip Temperature Sensor |
Yes |
— |
| Operating Temperature |
-40 ~ +100 (TJ) |
°C |
| Package / Case |
153-VFBGA (8×8 mm) |
— |
| Mounting Type |
Surface Mount |
— |
| Terminal Pitch |
0.5 |
mm |
| Seated Height (Max) |
1.0 |
mm |
| Process Technology |
55 nm TSMC Embedded Flash |
nm |
Core Features & Advantages
The 10M08SAM153I7G delivers exceptional performance for demanding applications.
- Primary Function: Single-chip, non-volatile, low-cost FPGA for system-level integration with on-chip Flash, ADC, and DSP capabilities.
- Key Advantages:
- Instant-On Non-Volatile Operation: Internal dual configuration flash eliminates the need for external configuration devices. The FPGA powers up with its configuration already loaded, enabling sub-millisecond boot times critical for system management and safety-critical applications.
- Integrated 12-bit ADC with Temperature Sensor: On-chip SAR ADC supporting up to 1 MSPS with 17 analog input channels eliminates the need for a separate ADC IC, reducing BOM cost and board area. The built-in temperature sensor enables thermal monitoring without external components.
- Ultra-Compact 8×8 mm MBGA-153 Package: At only 8×8 mm with 0.5 mm pitch, this is one of the smallest FPGA packages available at the 8K LE density, making it ideal for space-constrained designs in portable and embedded systems.
- SEU Detection & AES Encryption: Built-in single-event upset (SEU) error detection and correction, plus AES-256 encryption for secure bitstream protection — essential for industrial and defense applications.
- Dual Configuration Flash with Remote Update: Supports in-field firmware updates via dual-flash bank architecture, enabling live system upgrades without downtime.
Typical Application Scenarios
- Industry: Industrial Automation, Automotive, Consumer Electronics, Communications
- Equipment: PLCs, motor controllers, sensor hubs, I/O expansion modules, communication gateways, automotive ECUs
- Use Cases:
- Industrial I/O Expansion & System Management: Offloading real-time I/O control and monitoring from the host MCU/CPU, with instant-on capability ensuring deterministic startup behavior.
- Motor Control & Power Conversion: Leveraging integrated ADC and embedded multipliers for closed-loop motor control, sensor feedback processing, and PWM generation in a single-chip solution.
- Automotive Sensor Fusion & Gateway: Aggregating and preprocessing sensor data (temperature, voltage, current) via on-chip ADC before transmitting to the main ECU, reducing processor overhead.
Market Reference Price
| Market |
Price Range |
Currency |
| Huaqiangbei Spot |
$28.00 – $42.00 |
USD |
| Overseas B2B (DigiKey/Mouser) |
$34.62 – $44.39 |
USD |
Note: Prices vary by quantity, batch date, and supplier. Contact for exact quote. DigiKey and Mouser list unit pricing at $44.39 (qty 1) and $34.62 (qty 100+). Huaqiangbei spot market pricing is typically 20–35% below authorized distributor list prices.
Related Models Comparison
| Model |
Difference |
Target Application |
| 10M08SAM153C8G |
Commercial grade (0°C to 85°C), speed grade 8 (slower) |
Consumer electronics, cost-sensitive designs |
| 10M08SCM153I7G |
Same density/package, different I/O bank configuration (SC vs SA series) |
Industrial designs needing alternative I/O configurations |
| 10M04SAM153I7G |
4K LEs (half the logic), same 153-MBGA package — lower cost |
Applications requiring fewer logic resources with same footprint |
| 10M08SAU169I7G |
169-pin MBGA package, same 8K LEs — more I/O pins available |
Designs requiring additional I/O beyond 112 pins |
| 10M08DAF256I7G |
256-pin FBGA, dual ADC, 250 I/O — full-featured variant |
High-performance applications needing dual ADC and maximum I/O |
