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Differentiated Wearable Design: Bluetooth 4.0 BLE Anti-Lost Smart Sports Watch Solution

June 22, 2026

Appliance Solution, Business

Power Bank Design and Development: Complete Safety Engineering Guide to Prevent Overheating & Explosion

June 15, 2026

Appliance Solution, Business, Technology

Household Aroma Diffuser Solution Development: High Cost-Performance Design Based on FMD 8-bit MCU

June 14, 2026

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AT24C02 – 2Kbit I2C Serial EEPROM 1.7V to 5.5V

AT24C02 – 2Kbit I2C Serial EEPROM 1.7V to 5.5V

June 13, 2026

Basic Product Information Part Number: AT24C02 Field Value Manufacturer Microchip Technology (formerly Atmel) Device Type AT24C02 Package 8-PDIP / 8-SOIC / 8-TSSOP / 8-UDFN Compliance

STM32F405RGT6 – ARM Cortex-M4F 168MHz 1MB Flash MCU with FPU

STM32F405RGT6 – ARM Cortex-M4F 168MHz 1MB Flash MCU with FPU

June 13, 2026

Basic Product Information Part Number: STM32F405RGT6 Field Value Manufacturer STMicroelectronics Device Type STM32F405RGT6 Package LQFP-64 (10 x 10 x 1.45 mm) Compliance RoHS3 / REACH

ICM-42688-P – High Precision 6-Axis MEMS MotionTracking IMU

ICM-42688-P – High Precision 6-Axis MEMS MotionTracking IMU

June 13, 2026

Basic Product Information Part Number: ICM-42688-P Field Value Manufacturer TDK InvenSense Device Type ICM-42688-P Package LGA-14 (2.5 x 3 x 0.91 mm) Compliance RoHS /

STM32F103C8T6 – ARM Cortex-M3 72MHz 64KB Flash Microcontroller

STM32F103C8T6 – ARM Cortex-M3 72MHz 64KB Flash Microcontroller

June 13, 2026

Basic Product Information Part Number: STM32F103C8T6 Field Value Manufacturer STMicroelectronics Device Type STM32F103C8T6 Package LQFP-48 (7 x 7 x 1.4 mm) Compliance RoHS3 / ECOPACK2

W25Q64JVSSIQ – Winbond 64Mb Quad SPI NOR Flash 133MHz SOIC-8

W25Q64JVSSIQ – Winbond 64Mb Quad SPI NOR Flash 133MHz SOIC-8

June 13, 2026

Basic Product Information Part Number: W25Q64JVSSIQ Field Value Manufacturer Winbond Electronics Device Type W25Q64JVSSIQ Package 8-SOIC (0.209″, 5.30mm Width, 208-mil) Compliance RoHS3 / REACH Compliant

KLM8G1GETF-B041 – Samsung 8GB eMMC 5.1 HS400 FBGA-153 Storage IC

KLM8G1GETF-B041 – Samsung 8GB eMMC 5.1 HS400 FBGA-153 Storage IC

June 13, 2026

Basic Product Information Part Number: KLM8G1GETF-B041 Field Value Manufacturer Samsung Semiconductor Device Type KLM8G1GETF-B041 Package FBGA-153 (11.5 x 13 x 0.8 mm) Compliance RoHS Compliant

TPS5430DDAR – Wide Input 3A 500kHz Step-Down Buck Converter

TPS5430DDAR – Wide Input 3A 500kHz Step-Down Buck Converter

June 13, 2026

Basic Product Information Part Number: TPS5430DDAR Field Value Manufacturer Texas Instruments (TI) Device Type TPS5430DDAR Package HSOIC-8 (SO PowerPAD, DDA) Compliance RoHS / REACH Compliant

PRTR5V0U2X – Ultra Low Capacitance Double Rail-to-Rail ESD Protection Diode

PRTR5V0U2X – Ultra Low Capacitance Double Rail-to-Rail ESD Protection Diode

June 13, 2026

Basic Product Information Part Number: PRTR5V0U2X Field Value Manufacturer Nexperia Device Type PRTR5V0U2X Package SOT-143B Compliance RoHS / REACH Compliant Grade Industrial Core Electrical Parameters

MMBT3904LT1G – NPN General Purpose BJT SOT-23

MMBT3904LT1G – NPN General Purpose BJT SOT-23

June 13, 2026

Basic Product Information Part Number: MMBT3904LT1G Field Value Manufacturer onsemi (formerly ON Semiconductor / Fairchild) Device Type MMBT3904LT1G Package SOT-23-3 (TO-236-3, SC-59), 2.90mm x 1.30mm

DRV8301DCAR – 3-Phase BLDC Gate Driver With Buck Converter

DRV8301DCAR – 3-Phase BLDC Gate Driver With Buck Converter

June 13, 2026

Basic Product Information Part Number: DRV8301DCAR Field Value Manufacturer Texas Instruments (TI) Device Type DRV8301DCAR Package 56-HTSSOP (DCA), 14.1mm x 6.2mm x 1.05mm, PowerTFSOP with

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