MX29LV160DBTI-70G – Macronix 16Mbit 3V Parallel NOR Flash 70ns TSOP-48

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June 14, 2026

Basic Product Information

Part Number: MX29LV160DBTI-70G

Field Value
Manufacturer Macronix International (MXIC)
Device Type 16Mbit 3V Parallel NOR Flash Memory (70ns Access)
Package TSOP-48 (12 x 20mm)
Compliance RoHS
Grade Commercial (-40 to +85°C)

Core Electrical Parameters

Parameter Value Unit
Memory Capacity 16M-bit / 2M-byte
Organization 2M x 8 (Byte mode) / 1M x 16 (Word mode)
Interface Parallel (Address + Data bus)
Access Time 70 ns
Supply Voltage 2.7 to 3.6 V
Active Read Current (typ) 20 mA
Standby Current (typ) 3 μA
Sector Architecture Uniform 64KB sectors + 8KB boot sectors
Block/Sector Erase Chip / Block (64KB) / Sector (4KB/8KB)
Page Program Time (typ) 210 μs (per word)
Erase/Program Endurance 100,000 Cycles (minimum)
Data Retention 20 Years
Boot Block Configuration Bottom Boot (DB suffix) / Top Boot (DT suffix)
Operating Temperature -40 to +85 °C
Package Size 12 x 20 x 1.2 mm

Core Features & Advantages

The MX29LV160DBTI-70G delivers 16Mbit parallel NOR Flash with 70ns access time and bottom-boot sector architecture, designed for direct XIP firmware execution in embedded systems requiring parallel memory-mapped access.

  • Primary Function: 16M-bit 3V parallel NOR Flash memory with 70ns random access and bottom-boot sector layout for firmware storage and execute-in-place in embedded processors.
  • Advantages:
    • 70ns random access time — supports zero-wait-state XIP from many embedded processors, eliminating the need for Shadow RAM in boot-critical firmware.
    • Bottom-boot sector architecture (DB) — small 8KB boot sectors at the bottom of the address map enable safe bootloader storage with granularity, protecting the boot region while allowing application code updates in 64KB blocks.
    • Parallel memory-mapped interface — direct address/data bus connection to most embedded processors, enabling simpler firmware design compared to SPI Flash which requires serial protocol overhead.

Typical Application Scenarios

  • Industry: Industrial / Consumer / Networking / Automotive
  • Equipment: Embedded MCU/SoC systems, networking equipment, set-top boxes, automotive ECUs
  • Use Cases:
    • Firmware XIP storage for ARM7/9 and legacy embedded processors with parallel memory controllers.
    • Bootloader and application code storage in industrial PLCs and motor controllers requiring reliable parallel Flash.
    • Automotive ECU firmware with bottom-boot architecture for safe over-the-air bootloader updates and 64KB block application updates.

Market Reference Price

Market Price Range Currency
Huaqiangbei Spot $1.20 – $2.50 USD
Overseas B2B $1.80 – $3.50 USD

Related Models Comparison

Model Difference Application
MX29LV160DTTI-70G Top-boot sector layout (DT suffix vs DB bottom-boot), same 16Mbit capacity Systems requiring boot sectors at the top of the address map
MX29LV320DBTI-70G 32M-bit (double capacity), same TSOP-48 and 70ns access Larger firmware images requiring 4MB code space
W25Q128JVSIQ 128M-bit SPI (serial) Flash, much smaller SOIC-8 package, 133MHz SPI Modern MCU designs using SPI/Quad-SPI instead of parallel bus

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